目录
- 小尺寸 - 重量轻
-
极高的热导率
-
高峰值功率
-
纯金输入板
-
高功率
- Compact size
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Omni-directional Radiation
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Reflow process compatible
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RoHS compliant
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LTCC process
- Small standard size 0402 case size
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Edgetrimmedblockresistors
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High purity alumina substrate
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Ohmicrange (10 Ω to 1000Ω)
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Small internal reactance (< 10mΩ)
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Low TCR (down to ±25 ppm/℃)
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Epoxybondableterminationavailable
- 小尺寸 - 重量轻
-
极高的热导率
-
高峰值功率
-
纯金输入板
-
高功率20W
- Multilayer monolithic construction yields high reliability
-
Low ion loss and small size SMD chip design
-
Can simplify your complex tuning and circuit design
-
LTCC process
- 尺寸小
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输出端口间90°相位差
-
30W的功率容量
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湿度敏感度等级:MSL1
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频段过温稳定
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操作&存储温度:-55℃ to +125℃
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特性阻抗:50Ω
-
表贴焊接和金丝键合封装
- Small Size
-
Solder Surface Mount Package
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Moisture Sensitivity Level: MSL1
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Frequency Stable over Temperature
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Operating & Storage Temp: -55˚C to +125˚C
- Broad Band 6 to 32 GHz Performance
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0.7 dB Typical Insertion Loss
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20dB Typical Isolation and Return Loss
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Excellent Phase and Amplitude Balance
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Compact Solder Surface Mount Package
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- 小型化;
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高可靠性;
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温度范围宽;
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50Ω共面波导输出
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金丝键合,适用多芯片集成模块应用;
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- Adopting advance GaAs
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Excellent attenuation
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High ESD level
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Low VSWR
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